A 200 mm high density plasma tool with load-lock mainly used room temperature deposition of low stress Si3N4. 5 nm thick films have a breakdown voltage of 4 x 106 V/cm. The tool has arrived but is being installed and the process capability being developed. The tool is load locked on a cluster tool robot with direct access to ALD and chlorine chemistry ICP RIE by vacuum transfer.
Gases: SiH4, N2O, N2, Ar, He, O2, CF4&O2
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