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STS ICP RIE

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A 150 mm high density plasma tool with load-lock mainly used for deep Si etching using the Bosch process. The tool is used for a range of MEMS, NEMS and silicon optoelectronic & nanoelectronic research. Gases: SF6, C4F8, N2, Ar, He, O2 Materials etched: Si and SOI (Bosch process, mixed process), Ge, SiGe
Part of Organization: James Watt Building

Contact Professor Douglas Paul Douglas.Paul@ glasgow.ac.uk

Issues with this record should be reported to Linsey.Robertson@glasgow.ac.uk