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Vistec VB6 UHR EWF electron beam lithography tool

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Maximum substrate / wafer size of 200 mm Gaussian beam step and exposure writing strategy Thermal field emission gun with 50 keV and 100 keV operation Minimum spot size < 4 nm Demonstrated single lines down to < 5 nm using HSQ resist 0.46 nm rms layer-to-layer alignment Extra wide field of 1.3 mm at both 50 and 100 keV Laser interferometer stage with 0.62 nm resolution 50 MHz pattern generator Full automated alignment Multi-substrate load lock - we run up to 4000 hours of pattern writing per annum
Part of Organization: James Watt Building

Contact Professor Douglas Paul Douglas.Paul@ glasgow.ac.uk

Issues with this record should be reported to Linsey.Robertson@glasgow.ac.uk